Socionext will present at SEMICON Japan 2024 / APCS 2024
Socionext will be presenting at APCS (Advanced Packaging and Chiplet Summit) 2024, co-held with SEMICON Japan 2024 at Tokyo Big Sight (Koto-ku, Tokyo) from Wednesday, December 11 to Friday, December 13, 2024.
The presentation will cover Socionext's expectations for advanced packaging technologies such as chiplets, as well as the company's challenges and efforts in developing increasingly complex SoCs.
Event Information
| Title | APCS 2024 at SEMICON Japan 2024 |
|---|---|
| Period | Wednesday, December 11 to Friday, December 13, 2024 |
| Venue | Tokyo Big Sight (Koto-ku, Tokyo) |
| Organizer | SEMI Japan |
Socionext Presentation
| Session | APCS Technology Ⅲ User Perspective Session User Demands and Expectations for Advanced Semiconductors and 3D Packaging |
|---|---|
| Date/Time | Friday, December 13, 2024 10:30 to 12:10 |
| Venue | Reception B, Conference Tower 1F |
| Title | Challenges and Initiatives of Fabless Company Providing Advanced, Large-Scale SoCs Optimized for Customer |
| Time | 11:00 to 11:30 |
| Speaker | Mitsugu Naito Corporate Executive Vice President, Socionext Inc. |