SoC Package
Package System
By utilizing the latest packaging technologies, including 2.5D and chiplets, we provide a wide range of packages to suit different uses, from high performance models for high end use to high cost-performance models for consumer use.
![Package System](images/package_01.jpg)
Package Roadmap
Through a strong partnership with outsource assembly and test (OSAT) in Japan and overseas, we provide packages with well balanced technology, cost, quality, and reliability.
![Package Roadmap](images/package_02.jpg)